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ADA4855-3YCPZ-R7 Datasheet(PDF) 5 Page - Analog Devices

No. de pieza ADA4855-3YCPZ-R7
Descripción Electrónicos  Single Supply, High Speed, Rail-to-Rail Output, Triple Op Amp
PDF  20 Pages
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADA4855-3YCPZ-R7 Datasheet(HTML) 5 Page - Analog Devices

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ADA4855-3
Rev. 0 | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
Supply Voltage
6 V
Internal Power Dissipation1
See Figure 3
Common-Mode Input Voltage
(−VS − 0.2 V) to (+VS − 1 V)
Differential Input Voltage
±VS
Output Short-Circuit Duration
Observe power curves
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +105°C
Lead Temperature (Soldering, 10 sec)
300°C
1 Specification is for device in free air.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is specified
for a device soldered in a circuit board for surface-mount packages.
Table 4.
Package Type
θJA
θJC
Unit
16-Lead LFCSP
67
17.5
°C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
ADA4855-3 is limited by the associated rise in junction
temperature. The maximum safe junction temperature for
plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit may cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
To ensure proper operation, it is necessary to observe the
maximum power derating curves.
3.0
2.5
2.0
1.5
1.0
0.5
0
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION



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