AD9783-EBZ datasheet(35/36 Pages) AD

35 / 36 page

AD9780/AD9781/AD9783

Rev. A | Page 35 of 36

COMPLIANT TO JEDEC STANDARDS MO-220-VNND-4

OUTLINE DIMENSIONS

0.60

0.42

0.24

0.20 REF

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

0.50

0.40

0.30

8.50 REF

4.70

BSC SQ

EXPOSED

PAD

(BOTTOM VIEW)

TOP VIEW

9.75

BSC SQ

10.00

BSC SQ

PIN 1

INDICATOR

SEATING

PLANE

12° MAX

0.60

0.42

0.24

PIN 1

INDICATOR

0.30

0.23

0.18

0.50

BSC

COPLANARITY

0.08

EXPOSED PAD MUST BE

SOLDERED TO PCB AND

CONNECTED TO AVSS.

Figure 79. 72-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

10 mm × 10 mm, Very Thin Quad

(CP-72-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD9780BCPZ1

−40°C to +85°C

72-Lead LFCSP_VQ

CP-72-1

AD9780BCPZRL1

−40°C to +85°C

72-Lead LFCSP_VQ

CP-72-1

AD9781BCPZ1

−40°C to +85°C

72-Lead LFCSP_VQ

CP-72-1

AD9781BCPZRL1

−40°C to +85°C

72-Lead LFCSP_VQ

CP-72-1

AD9783BCPZ1

−40°C to +85°C

72-Lead LFCSP_VQ

CP-72-1

AD9783BCPZRL1

−40°C to +85°C

72-Lead LFCSP_VQ

CP-72-1

AD9780-EBZ1

Evaluation Board

AD9781-EBZ1

Evaluation Board

AD9783-EBZ1

Evaluation Board

1 Z = RoHS Compliant Part.

AD9783-EBZ Datasheet(PDF) 35 Page - Analog Devices

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