M38047F9HKP datasheet(90/116 Pages) RENESAS

No. de pieza	M38047F9HKP

Descripción Electrónicos	SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER

PDF	116 Pages

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Fabricante Electrónico	RENESAS [Renesas Technology Corp]

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90 / 116 page

Rev.1.01

Jan 25, 2005

page 90 of 114

REJ03B0131-0101Z

3804 Group (Spec. H)

q Parallel I/O Mode

The parallel I/O mode is used to input/output software commands,

address and data in parallel for operation (read, program and

erase) to internal flash memory.

Use the external device (writer) only for 3804 Group (spec. H). For

details, refer to the user’s manual of each writer manufacturer.

• User ROM and Boot ROM Areas

In parallel I/O mode, the User ROM and Boot ROM areas shown

in Figure 77 can be rewritten. Both areas of flash memory can be

operated on in the same way.

The Boot ROM area is 4 Kbytes in size and located at addresses

F00016 through FFFF16. Make sure program and block erase op-

erations are always performed within this address range. (Access

to any location outside this address range is prohibited.)

In the Boot ROM area, an erase block operation is applied to only

one 4 Kbyte block. The boot ROM area has had a standard serial

I/O mode control program stored in it when shipped from the fac-tory.

Therefore, using the MCU in standard serial I/O mode, do not

rewrite to the Boot ROM area.

M38047F9HKP Datasheet(PDF) 90 Page - Renesas Technology Corp