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HD151TS307ARP Datasheet(PDF) 5 Page - Renesas Technology Corp

No. de pieza HD151TS307ARP
Descripción Electrónicos  Spread Spectrum Clock for EMI Solution
PDF  9 Pages
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Fabricante Electrónico  RENESAS [Renesas Technology Corp]
Página de inicio  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HD151TS307ARP Datasheet(HTML) 5 Page - Renesas Technology Corp

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HD151TS307ARP
Rev.4.00 Jul. 08, 2004 page 5 of 8
tcycle n
t
= (tcycle n) - (tcycle n+1)
CCS
tcycle n+1
SSCCLKOUT
Figure 1 Cycle to cycle jitter
Application Information
1. Recommended Circuit Configuration
The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2.
VDD decoupling is important to both reduce Jitter and EMI radiation.
The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased trace
inductance will negate its decoupling capability.
The C2 decoupling capacitor shown should be a tantalum type.
8
1
7
SSCCLKOUT
6
SEL0
SEL1
NC
5
2
3
4
XIN
XOUT
R1
C1
C2
GND GND
GND
VDD
(Crystal or
Reference input)
(Crystal or
Not connection)
Notes:
C1 = High frequency supply decoupling capacitor.
(0.1
µF recommended)
C2 = Low frequency supply decoupling capacitor.
(22
µF tantalum type recommended)
R1 = Match value to line impedance.
(22
Ω Reference value)
Figure 2 Recommended circuit configuration



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