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HD151TS307ARP Datasheet(PDF) 5 Page - Renesas Technology Corp |
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HD151TS307ARP Datasheet(HTML) 5 Page - Renesas Technology Corp |
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5 / 9 page ![]() HD151TS307ARP Rev.4.00 Jul. 08, 2004 page 5 of 8 tcycle n t = (tcycle n) - (tcycle n+1) CCS tcycle n+1 SSCCLKOUT Figure 1 Cycle to cycle jitter Application Information 1. Recommended Circuit Configuration The power supply circuit of the optimal performance on the application of a system should refer to Fig. 2. VDD decoupling is important to both reduce Jitter and EMI radiation. The C1 decoupling capacitor should be placed as close to the VDD pin as possible, otherwise the increased trace inductance will negate its decoupling capability. The C2 decoupling capacitor shown should be a tantalum type. 8 1 7 SSCCLKOUT 6 SEL0 SEL1 NC 5 2 3 4 XIN XOUT R1 C1 C2 GND GND GND VDD (Crystal or Reference input) (Crystal or Not connection) Notes: C1 = High frequency supply decoupling capacitor. (0.1 µF recommended) C2 = Low frequency supply decoupling capacitor. (22 µF tantalum type recommended) R1 = Match value to line impedance. (22 Ω Reference value) Figure 2 Recommended circuit configuration |
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