STPS2L25U datasheet(3/4 Pages) STMICROELECTRONICS

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1E-3

1E-2

1E-1

1E+0

IM(A)

Ta=25°C

Ta=100°C

Ta=50°C

t(s)

δ=0.5

Fig. 3: Non repetitive surge peak forward current

versus overload duration (maximum values).

1E-2

1E-1

1E+0

1E+1

1E+2

5E+2

0.0

0.2

0.4

0.6

0.8

1.0

tp(s)

Zth(j-a)/Rth(j-a)

δ = 0.1

δ = 0.2

δ = 0.5

Single pulse

δ=tp/T

Fig. 4: Relative variation of thermal impedance

junction to ambient versus pulse duration.

1E-3

1E-2

1E-1

1E+0

1E+1

1E+2

IR(mA)

Tj=125°C

Tj=25°C

Tj=100°C

Tj=150°C

VR(V)

Fig. 5: Reverse leakage current versus reverse

voltage applied (typical values).

100

500

VR(V)

C(pF)

F=1MHz

Tj=25°C

Fig. 6: Junction capacitance versus reverse

voltage applied (typical values).

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.01

0.10

1.00

10.00

IFM(A)

Tj=125°C

Tj=25°C

Tj=100°C

VFM(V)

Typical values

Tj=150°C

Fig. 7: Forward voltage drop versus forward cur-

rent (maximum values).

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

100

120

S(Cu) (cm²)

Rth(j-a) (°C/W)

Fig. 8: Thermal resistance junction to ambient ver-

sus copper surface under each lead (Epoxy printed

circuit board FR4, copper thickness: 35

µm).

STPS2L25U

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