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L6258EP Datasheet(PDF) 30 Page - STMicroelectronics

No. de pieza L6258EP
Descripción Electrónicos  PWM controlled high current DMOS universal motor driver
PDF  32 Pages
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Fabricante Electrónico  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

L6258EP Datasheet(HTML) 30 Page - STMicroelectronics

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Package information
L6258EP
30/32
6
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 14.
PowerSSO36 mechanical data & package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
2.15
2.47
0.084
0.097
A2
2.15
2.40
0.084
0.094
a1
0
0.075
0
0.003
b
0.18
0.36
0.007
0.014
c
0.23
0.32
0.009
0.012
D (1)
10.10
10.50
0.398
0.413
E (1)
7.4
7.6
0.291
0.299
e
0.5
0.019
e3
8.5
0.335
F
2.3
0.090
G
0.10
0.004
G1
0.06
0.002
H
10.10
10.50
0.398
0.413
h
0.40
0.016
k5˚
L
0.55
0.90
0.022
0.035
M
4.3
0.169
N
10˚
10˚
O
1.2
0.047
Q
0.8
0.031
S
2.9
0.114
T3.65
0.144
U
1.0
0.039
X
4.1
4.7
0.161
0.185
Y
6.5
7.3
0.256
0.287
(1) "D” and “E" do not include mold flash or protrusions Mold flash
or protrusions shall not exceed 0.15 mm per side(0.006”)
PowerSSO-36
7587131 A
(slug-down)
G
LEAD COPLANARITY
BOTTOM VIEW
D
e3
0.1
A
M
B
b
e
A
Y
T
M
L
hx45û
U
O
B



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