ACS102-6T

Package information

9/11

Figure 18.

SO-8 Footprint

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Table 6.

SO-8 Mechanical data

REF.

DIMENSIONS

Millimetres

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.350

1.75

0.053

0.069

A1

0.100

0.250 0.004

0.010

A2

1.100

1.650 0.043

0.065

B

0.330

0.510 0.013

0.020

C

0.190

0.250 0.008

0.010

D

4.800

5.000 0.189

0.197

E

3.800

4.000 0.150

0.157

e

1.270

0.050

H

5.800

6.200 0.228

0.244

h

0.250

0.500 0.010

0.020

L

0.400

1.270 0.016

0.050

k

0°8°

0°8°

ddd

0.100

0.004

E

D

8

4

1

5

H

k

h x 45°

L

C

(Seating

Plane)

0.25mm

(Gage Plane)

e

A

A2

B

A1

ddd C

6.8

4.2

1.27

0.6