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TS912 Datasheet(PDF) 14 Page - STMicroelectronics |
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TS912 Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 18 page ![]() Package information TS912 14/18 HSCP 68 25 VSCP1 1E8 DON 69 19 MDTH 400E-12 VON 24 5 2.4419107 HSCN 24 69 VSCN1 1.5E8 VSCTHP 60 61 0.1375 DSCP1 61 63 MDTH 400E-12 VSCP1 63 64 0 ISCP 64 0 1.000000E-8 DSCP2 0 64 MDTH 400E-12 DSCN2 0 74 MDTH 400E-12 ISCN 74 0 1.000000E-8 VSCN1 73 74 0 DSCN1 71 73 MDTH 400E-12 VSCTHN 71 70 -0.75 ESCP 60 0 2 1 500 ESCN 70 0 2 1 -2000 .ENDS 5 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. |
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