Package information

TL074

12/15

6

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

6.1

DIP14 package information

Figure 24.

DIP14 package mechanical drawing

Table 4.

DIP14 package mechanical data

Ref.

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

a1

0.51

0.020

B

1.39

1.65

0.055

0.065

b0.5

0.020

b1

0.25

0.010

D20

0.787

E8.5

0.335

e

2.54

0.100

e3

15.24

0.600

F

7.1

0.280

I

5.1

0.201

L3.3

0.130

Z

1.27

2.54

0.050

0.100