BAT30 datasheet(4/12 Pages) STMICROELECTRONICS

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Characteristics

BAT30 Series

4/12

Figure 5.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOT-666)

Figure 6.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOD-523)

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration (SOD-323)

Figure 8.

Leakage current versus reverse

applied voltage (typical values)

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

SOT-666

Epoxy FR4

CU=35 µm

(s)

th(j-a)/Rth(j-a)

1.E-03

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

SOD-523

Epoxy FR4

CU=35 µm

th(j-a)/Rth(j-a)

(s)

200

300

400

500

600

th(j-a)(°C/W)

Epoxy FR4

CU=35 µm

SCU(mm²)

1.E-07

1.E-06

1.E-05

1.E-04

1.E-03

1.E-02

R (A)

j=150°C

j=25°C

j=85°C

j=125°C

VR (V)

Figure 9.

Relative variation of reverse

leakage current versus junction

temperature (typical values)

Figure 10.

Junction capacitance versus

reverse applied voltage (typical

values)

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

-40

-20

100

120

140

160

R[Tj]/ IR[Tj=25°C]

R=30 V

Tj(°C)

100

C(pF)

F=1 MHz

OSC=30 mVRMS

j=25 °C

VR(V)

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