Data Sheet

ADP1706/ADP1707/ADP1708

ABSOLUTE MAXIMUM RATINGS

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Rev. B | 5 of 19

Table 2.

Parameter

Rating

IN to GND

−0.3 V to +6 V

OUT to GND

–0.3 V to IN

EN to GND

–0.3 V to +6 V

SS/ADJ/TRK to GND

–0.3 V to +6 V

SENSE to GND

–0.3 V to +6 V

Storage Temperature Range

–65°C to +150°C

Operating Junction Temperature Range

–40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

θJA

Unit

8-Lead SOIC (Exposed Paddle)

58

°C/W

8-Lead 3 mm × 3 mm LFCSP (Exposed Paddle)

66

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.