Data Sheet

ADP150

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. E | 5 of 20

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6.5 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to +6.5 V

Temperature Range

Storage

−65°C to +150°C

Operating Junction

−40°C to +125°C

Operating Ambient

−40°C to +85°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in combina-

tion. The ADP150 can be damaged when the junction temperature

limits are exceeded. Monitoring ambient temperature does not

guarantee that TJ is within the specified temperature limits. In appli-

cations with high power dissipation and poor thermal resistance, the

maximum ambient temperature may have to be derated.

In applications with moderate power dissipation and low printed

circuit board (PCB) thermal resistance, the maximum ambient tem-

perature can exceed the maximum limit as long as the junction

temperature is within specification limits. The junction temperature

(TJ) of the device is dependent on the ambient temperature (TA),

the power dissipation of the device (PD), and the junction-to-ambi-

ent thermal resistance of the package (θJA).

Maximum junction temperature (TJ) is calculated from the ambient

temperature (TA) and power dissipation (PD) by

TJ = TA + (PD × θJA)

The junction to ambient thermal resistance (θJA) of the package is

based on modeling and a calculation using a 4-layer board. The

junction to ambient thermal resistance is highly dependent on the

application and board layout. In applications where high maximum

power dissipation exists, close attention to thermal board design is

required. The value of θJA can vary, depending on PCB material,

layout, and environmental conditions. The specified values of θJA

are based on a 4-layer, 4 inch × 3 inch circuit board. Refer to

JESD 51-7 and JESD 51-9 for detailed information on the board

construction. For additional information, see the AN-617 Application

Note, Wafer Level Chip Scale Package.

ΨJB is the junction-to-board thermal characterization parameter with

units of °C/W. ΨJB of the package is based on modeling and

a calculation using a 4-layer board. The JESD51-12, Guidelines

for Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing through

multiple thermal paths rather than a single path as in thermal

resistance, θJB. Therefore, ΨJB thermal paths include convection

from the top of the package as well as radiation from the pack-

age, factors that make ΨJB more useful in real-world applications.

Maximum junction temperature (TJ) is calculated from the board

temperature (TB) and power dissipation (PD) by

TJ = TB + (PD × ΨJB)

Refer to JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

5-Lead TSOT

170

43

°C/W

4-Ball, 0.4 mm Pitch WLCSP

260

58

°C/W

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.