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ADP150AUJZ-2.65-R7 Datasheet(PDF) 17 Page - Analog Devices |
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ADP150AUJZ-2.65-R7 Datasheet(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() Data Sheet ADP150 APPLICATIONS INFORMATION analog.com Rev. E | 17 of 20 Figure 46. WLCSP, 100 mm2 of PCB Copper, Board Temperature = 85°C PCB LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP150. However, as listed in Table 7, a point of diminishing returns is reached eventually, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VIN and GND pins. Place the output capacitor as close as possible to the VOUT and GND pins. Use of 0402 size or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. Figure 47. Example TSOT PCB Layout Figure 48. Example WLCSP PCB Layout |
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