LW Y87C

DATASHEET

DATASHEET

2 | Version 1.4 | 2023-04-06

Micro SIDELED® 3010

LW Y87C

Applications

- Access Control & Security

- Appliances & Tools

- Computing

- Display Backlighting

- Factory Automation

- Home & Building Automation

- Material Processing

- Projection & Display

- Robotics

- Smart Surface

- Visualization

Features

- Package: white SMT package, colored diffused resin

- Chip technology: InGaN

- Typ. Radiation: 120° (horizontal), 120° (vertical)

- Color: Cx = 0.33, Cy = 0.33 acc. to CIE 1931 (● white)

- Corrosion Robustness Class: 3B

- Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,

Stress Test Qualification for Automotive Grade Discrete Semiconductors.

- ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)