MPC852T datasheet(7/80 Pages) FREESCALE

7 / 80 page

MPC852T PowerQUICC™ Hardware Specifications, Rev. 4

Freescale Semiconductor

Thermal Characteristics

This device contains circuitry protecting against damage that high-static voltage or electrical fields cause;

however, Freescale recommends taking normal precautions to avoid application of any voltages higher

than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if

unused inputs are tied to an appropriate logic voltage level (for example, either GND or VDD).

Thermal Characteristics

Table 3 shows the thermal characteristics for the MPC852T.

Table 2. Operating Temperatures

Rating

Symbol

Value

Unit

Temperature 1 (standard)

1 Minimum temperatures are guaranteed as ambient temperature, T

A. Maximum temperatures are guaranteed as junction

temperature, Tj.

TA(min)

0°C

Tj(max)

°C

Temperature (extended)

TA(min)

– 40

°C

Tj(max)

100

°C

Table 3. MPC852T Thermal Resistance Data

Rating

Environment

Symbol

Value

Unit

Junction-to-ambient1

1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance.

Natural convection

Single-layer board (1s)

RθJA

2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal

°C/W

Four-layer board (2s2p)

RθJMA

3 Per JEDEC JESD51-6 with the board horizontal

Airflow (200 ft/min)

Single-layer board (1s)

RθJMA

Four-layer board (2s2p)

RθJMA

Junction-to-board4

4 Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

RθJB

Junction-to-case5

5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages

where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to

the exposed pad without contact resistance.

RθJC

Junction-to-package top6

6 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2

Natural convection

ΨJT

Airflow (200 ft/min)

ΨJT

MPC852T Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc

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