Differential LVPECL
Clock Oscillator
SUGGESTED PAD LAYOUT
.071 SQ
(1.80)
.148
(3.75)
.200
(5.08)
.075
(1.80)
.283
(7.20)
.203
(5.15)
All dimensions are Max unless otherwise specified.
Dimensions inches (mm)
.055 ±.003
(1.40 ±.08)
.200 ±.005
(5.08 ±.13)
#6
.055 ±.003
(1.40 ±.08)
Denotes pad 1
P/N
Freq DC
#5
#4
#3
#2
#1
Bypass Capacitor Recommended
Specifications subject to change without notice.
Designed to meet today's
requirements for 3.3V
Complementary LVPECL
applications. The CCPD-033
uses a high Q crystal providing
very low jitter and phase noise
for demanding applications.
Available on 16mm tape and
reel in quantities of 1K.
5X7 mm SMD,
3.3V, LVPECL
CCPD-033 Model
E/D pin
Output pin
Open
"1" level 0.7V Min
"0" level 0.3V Max
Active
Active
High Z
Tri-State Function
Table 3
77.760MHz to 161.1328MHz
±20ppm to ±100ppm
0°C to 70°C
-20°C to 70°C
-40°C to 85°C
-55°C to 120°C
3.3V ± 0.3V
55mA Typ, 88mA Max
Differential LVPECL
45/55% Max @ 50% Vdd
1ns Max @ 20% to 80% Vdd
into 50 ohms
"0" = 1.490 Min, 1.680 Max
"1" = 2.275 Min, 2.420 Max
"0" = 1.470 Min, 1.745 Max
"1" = 2.215 Min, 2.420 Max
200ns Max
1mSec Typ., 2mSec Max
0.5 psec Typ., 1ps RMS Max
-65dBc Typical
-98dBc Typical
-125dBc Typical
-140dBc Typical
-145dBc Typical
<3ppm 1st/yr, <1ppm every year thereafter
Frequency Range:
Frequency Stability:
Temperature Range:
(Option M)
(Option X)
Storage:
Input Voltage:
Input Current:
Output:
Symmetry:
Rise/Fall Time:
Logic:
Terminated to Vdd-2V
Temp. 0°C to 85°C
Temp. -40°C to 0°C
Disable Time
Start-up Time
Phase Jitter:
12KHz to 80MHz
Phase Noise:
10Hz
100Hz
1KHz
10KHz
100KHz~100MHz
Aging:
TD-020904 Rev.K
CCPD-033 X - 25 - 155.520
Crystek Part Number Guide
#1 Crystek 5x7 SMD PECL Osc.
#2 Model 033 = 3.3V
#3 Temp. Range: Blank = 0/70°C, M= -20/70°C, X= -40/85°C
#4 Stability: (see Table 1)
#5 Frequency in MHz: 3 or 6 decimal places
#1
#2
#3
#5
Example:
CCPD-033X-25-155.520 = 3.3V, 45/55, -40/85°C, 25ppm, 155.520 MHz
#4
Blank (std)
± 100ppm
50
± 50ppm
25
± 25ppm
20 **
± 20ppm
** only available 0/70°C
Stability Indicator:
Table 1
Pad
Connection
1
2
3
4
5
6
E/D
N/C
GND
OUT
COUT
Vdd
Table 2
Shock:
Solderability:
Vibration:
Solvent Resistance:
Resistance to Soldering Heat:
Thermal Shock:
Moisture Resistance:
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2003
MIL-STD-883, Method 2007, Condition A
MIL-STD-202, Method 215
MIL-STD-202, Method 210, Condition I or J
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
Mechanical:
Environmental:
Le
ad
Fre
e
Ro
HS
Co
mp
lian
t
RECOMMENDED REFLOW SOLDERING PROFILE
217°C
200°C
260°C
150°C
90 Secs. Max.
Ramp-Up
3°C/Sec Max.
Preheat
180 Secs. Max.
8 Minutes Max.
260°C for
10 Secs. Max.
Critical Temperature
Zone
Ramp-Down
6°C/Sec.
NOTE: Reflow Profile with 240°C peak also acceptable.
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