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DS20005529D-page 22

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2017 - 2025 Microchip Technology Inc. and its subsidiaries

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Contact Pitch

MILLIMETERS

2.10 BSC

MIN

E

MAX

Contact Pad Length (X4)

Contact Pad Width (X4)

Y

X

1.00

0.90

NOM

12

4

C

Contact Pad Spacing

1.80

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

© 2024 Microchip Technology Inc.

Microchip Technology Drawing C04-3006-H4A Rev C

E

C

X

Y

(CH)

Contact 1 Index Chamfer

CH

0.20 REF

REF: Reference Dimension, usually without tolerance, for information purposes only.

SILK SCREEN

4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]