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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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Motor de Búsqueda de Datasheet de Componentes Electrónicos |
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ST7L09 Datasheet(PDF) 95 Page - STMicroelectronics |
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ST7L09 Datasheet(HTML) 95 Page - STMicroelectronics |
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95 / 104 page  ST7L05, ST7L09 95/104 PACKAGE CHARACTERISTICS (Cont’d) 14.3 SOLDERING INFORMATION In accordance with the RoHS European directive, all STMicroelectronics packages have been con- verted to lead-free technology named ECO- PACK ™. ■ ECOPACK ™ packages are qualified according to the JEDEC STD-020C compliant soldering profile. ■ Detailed information on the STMicroelectronics ECOPACK ™ transition program is available on www.st.com/stonline/leadfree/, with specific technical application notes covering the main technical aspects related to lead-free conversion (AN2033, AN2034, AN2035, and AN2036). Forward compatibility ECOPACK ™ SO packages are fully compatible with a lead (Pb) containing soldering process (see application note AN2034). Table 22. Soldering Compatibility (Wave and Reflow Soldering Process) Package Plating material Pb solder paste Pb-free solder paste SO NiPdAu (Nickel-Palladium-Gold) Yes Yes 1 |
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