M27C2001 datasheet(4/16 Pages) STMICROELECTRONICS

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M27C2001

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System Considerations

The power switching characteristics of Advanced

CMOS EPROMs require careful decoupling of the

devices. The supply current, ICC, has three seg-

ments that are of interest to the system designer:

the standby current level, the active current level,

and transient current peaks that are produced by

the falling and rising edges of E. The magnitude of

the transient current peaks is dependent on the

capacitive and inductive loading of the device at

the output.

The associated transient voltage peaks can be

suppressed by complying with the two line output

control and by properly selected decoupling ca-

pacitors. It is recommended that a 0.1

µF ceramic

capacitor be used on every device between VCC

and VSS. This should be a high frequency capaci-

tor of low inherent inductance and should be

placed as close to the device as possible. In addi-

tion, a 4.7

µF bulk electrolytic capacitor should be

used between VCC and VSS for every eight devic-

es. The bulk capacitor should be located near the

power supply connection point. The purpose of the

bulk capacitor is to overcome the voltage drop

caused by the inductive effects of PCB traces.

Table 5. AC Measurement Conditions

High Speed

Standard

Input Rise and Fall Times

≤ 10ns

≤ 20ns

Input Pulse Voltages

0 to 3V

0.4V to 2.4V

Input and Output Timing Ref. Voltages

1.5V

0.8V and 2V

Figure 3. AC Testing Input Output Waveform

AI01822

High Speed

1.5V

2.4V

Standard

0.4V

2.0V

0.8V

Figure 4. AC Testing Load Circuit

AI01823B

1.3V

OUT

CL = 30pF for High Speed

CL = 100pF for Standard

CL includes JIG capacitance

3.3k

Ω

1N914

DEVICE

UNDER

TEST

Table 6. Capacitance (1) (TA =25 °C, f = 1 MHz)

Note: 1. Sampled only, not 100% tested.

Symbol

Parameter

Test Condit ion

Min

Max

Unit

CIN

Input Capacitance

VIN =0V

6pF

COUT

Output Capacitance

VOUT =0V

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