HV232

DS20005820B-page 16

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RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.50 BSC

MIN

E

MAX

8.40

Contact Pad Length (X48)

Contact Pad Width (X48)

Y1

X1

1.50

0.30

Microchip Technology Drawing C04-2278 Rev A

NOM

48-Lead Low-profile Plastic Quad Flat Pack Package (R8) -7x7 mm Body [LQFP]

SILK SCREEN

C1

C2

E

X1

Y1

G

C1

Contact Pad Spacing

8.40

Contact Pad to Contact Pad (X44)

G

0.20

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

1.

2.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Supertex Legacy Package

12

48