L

E

e

D

M

e3

b

8

5

14

c1

s

PACKAGE MECHANICAL DATA

8 PINS - PLASTIC MICROPACKAGE (SO)

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

1.75

0.069

a1

0.1

0.25

0.004

0.010

a2

1.65

0.065

a3

0.65

0.85

0.026

0.033

b

0.35

0.48

0.014

0.019

b1

0.19

0.25

0.007

0.010

C

0.25

0.5

0.010

0.020

c1

45

D

4.8

5.0

0.189

0.197

E

5.8

6.2

0.228

0.244

e

1.27

0.050

e3

3.81

0.150

F

3.8

4.0

0.150

0.157

L

0.4

1.27

0.016

0.050

M

0.6

0.024

S8

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsi-

bility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which

may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON

Microelectronics. Specifications mentioned in this publ ication are subject to change without notice. This pub lication supersedes

and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical

components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics.

© 1994 SGS-THOMSON Microelectronics - All Rights Reserved

SGS-THOMSON Microelectronics GROUP OF COMPANIES

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Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

NE555/SA555/SE555

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