REV. B

–4–

AD8012

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8012

is limited by the associated rise in junction temperature. The maxi-

mum safe junction temperature for plastic encapsulated devices

is determined by the glass transition temperature of the plastic,

approximately +150

°C. Temporarily exceeding this limit may

cause a shift in parametric performance due to a change in the

stresses exerted on the die by the package. Exceeding a junction

temperature of +175

°C for an extended period can result in

device failure.

The output stage of the AD8012 is designed for maximum load

current capability. As a result, shorting the output to common

can cause the AD8012 to source or sink 500 mA. To ensure

proper operation, it is necessary to observe the maximum power

derating curves. Direct connection of the output to either power

supply rail can destroy the device.

AMBIENT TEMPERATURE – C

–50

0

2.0

1.5

1.0

8-LEAD SOIC

PACKAGE

–40 –30

010

20

3040 50

6070

80 90

8-LEAD

MSOP

0.5

–20 –10

Figure 3. Plot of Maximum Power Dissipation vs.

Temperature for AD8012

0.1 F

0.1 F

10 F

10 F

750

750

49.9

+

+

Test Circuit 1. Gain = +2

0.1 F

0.1 F

10 F

10 F

750

750

53.6

+

+

Test Circuit 2. Gain = –1

Test Circuits