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IMSC011 Datasheet(PDF) 23 Page - STMicroelectronics |
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IMSC011 Datasheet(HTML) 23 Page - STMicroelectronics |
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23 / 30 page ![]() 7 Electrical specifications /30 23 7.4 Power rating Internal power dissipation (PINT) of transputer and peripheral chips depends on VDD, as shown in figure 7.6. PINT is substantially independent of temperature. Power PINT (mW) 4.4 4.6 5.0 5.6 200 150 100 50 4.8 5.2 5.4 VDD (Volts) Figure 7.6 IMS C011 internal power dissipation vs VDD Total power dissipation (PD) of the chip is PD = PINT + PIO where PIO is the power dissipation in the input and output pins; this is application dependent. Internal working temperature TJ of the chip is TJ = TA + qJA *PD where TA is the external ambient temperature in oC and q JA is the junction-to-ambient thermal resistance in oC/W. Information about device thermal management can be found in the following SGS-THOMSON cata- logues, available from SGS-THOMSON sales offices and authorized distributors worldwide. 1 Thermal Management in Surface Mount Technology, order code: BRTHERMAN/0788 2 Reliability in Surface Mount Technology, order code: BRRELSMT/1088 |
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