6.4 Thermal Information

THERMAL METRIC(1)

TMUX1111 / TMUX1112 / TMUX1113

UNIT

PW (TSSOP)

RSV (QFN)

16 PINS

16 PINS

RθJA

Junction-to-ambient thermal resistance

124.7

146.8

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

54.8

83.5

°C/W

RθJB

Junction-to-board thermal resistance

70.9

75.5

°C/W

ΨJT

Junction-to-top characterization parameter

10.8

9.0

°C/W

ΨJB

Junction-to-board characterization parameter

70.3

73.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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TMUX1111, TMUX1112, TMUX1113

SCDS408C – FEBRUARY 2019 – REVISED DECEMBER 2023

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