NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

.

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

EXAMPLE BOARD LAYOUT

4225901/A 05/2020

www.ti.com

VQFN - 1 mm max height

RGF0040F

PLASTIC QUAD FLATPACK- NO LEAD

SYMM

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 12X

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

EXPOSED

METAL

EXPOSED

METAL

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

(4.8)

(3.7)

(5.7)

36X (0.5)

40X (0.6)

40X (0.25)

(6.8)

2X

(1.25)

2X

(1.35)

2X (0.625)

2X (0.975)

(Ø 0.2) VIA

TYP

(R 0.05) TYP

12

1

40

33

32

21

20

13

41