A21SP16 datasheet(35/37 Pages) STMICROELECTRONICS

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A21SP16

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK is an ST trademark.

Figure 67. Pin-out for 9-bump flip-chip (top view)

Figure 68. Marking for 9-bump flip-chip (top view)

Figure 69. Mechanical data for 9-bump flip-chip

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

1/A1

7/C1

8/C2

9/C3

4/B1

6/B3

2/A2

3/A3

5/B2

GND

STBY

GND

OUT

 Bumps are underneath

 Bump diameter = 300m

 ST Logo

 Symbol for lead-free: E

 Two first XX product code: W2

 third X: Assembly code

 Three digits date code: Y for year - WW for week

 The dot is for marking pin A1

XXX

YWW

XXX

YWW



Die size: 1.6 mm x 1.6 mm ±30

m



Die height (including bumps): 600

m



Bump diameter: 315

m 50 m



Bump diameter before reflow: 300

m 10 m



Bump height: 250

m ±40 m



Die height: 350

m ±20 m



Pitch: 500

m 50 m



Coplanarity: 50

m max

1.60 mm

0.5mm

 0.25mm

1.60 mm

0.5mm

 0.25mm

600µm

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