www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MIN

ALL AROUND

TYP

4X (0.25)

4X (0.4)

(0.25)

TYP

(R0.05) TYP

(0.6)

(0.8)

(0.4)

(0.2)

TYP

(0.027) TYP

(0.2) TYP

EXPOSED METAL

CLEARANCE

4X (0.271)

X2SON - 0.4 mm max height

DTQ0006A

PLASTIC SMALL OUTLINE - NO LEAD

4224056/B 07/2024

NOTES: (continued)

6. This package is designed to be soldered to a thermal pads on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

7. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

SYMM

1

2

3

SYMM

4

5

LAND PATTERN EXAMPLE

SOLDER MASK DEFINED

SCALE:50X

6

METAL UNDER

SOLDER MASK

TYP

TYP

SOLDER MASK OPENING