Figure 5. Relative variation of thermal impedance,

junction to ambient, versus pulse duration (epoxy printed

circuit board, copper thickness = 35 μm, recommended

pad layout)

Z

/R

th(j-a)

th(j-a)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Single pulse

t (s)

p

Figure 6. Thermal resistance, junction to ambient, versus

copper surface under tab (epoxy printed board FR4,

copper thickness = 35 μm)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SCu(cm²)

Rth(j-a) (°C/W)

STMite-Flat

Figure 7. Reverse leakage current versus voltage applied

(typical values)

I (µA)

R

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

0

2 0

4 0

60

8 0

100

Tj =150 °C

Tj =125 °C

Tj =25 °C

Tj =100 °C

Tj =75 °C

Tj =50 °C

V (V)

R

Figure 8. Junction capacitance versus reverse voltage

applied (typical values)

C(pF)

10

100

1

1 0

100

F = 1 MHz

VOSC=30 mVRMS

Tj=25 °C

V (V)

R

STPS1H100MF

Characteristics (curves)

DS5836 - Rev 2

page 4/9