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PACKAGE OUTLINE

C

8X

0.40

0.28

2.7 0.1

8X

0.5

0.4

2X

1.95

1.8 0.1

6X 0.65

1.55

1.45

0.05

0.00

0.32

0.12

B

3.4

3.2

A

3.4

3.2

(0.2) TYP

4X (0.2)

2X (0.98)

LSON-CLIP - 1.55 mm max height

DQZ0008A

PLASTIC SMALL OUTLINE - NO LEAD

4229809/A 07/2023

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

0.1

C A B

0.05

C

EXPOSED

THERMAL PAD

9

SYMM

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 3.600