DS6184 Rev 18

19/34

L5150CJ, L5150CS

Package and PCB thermal data

33

4

Package and PCB thermal data

4.1

PowerSSO-12 thermal data

Figure 26. PowerSSO-12 PC board(1)

1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,

FR4 area = 77 mm x 86 mm, PCB thickness = 1.6 mm, Cu thickness = 70 µm (front and back side),

thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,

footprint dimension 4.1 mm x 6.5 mm).

Figure 27. Rthj-amb vs PCB copper area in open box free air condition

GAPGCFT000120

RTHjamb

30

35

40

45

50

55

60

65

70

02

46

8

10

RTHjamb

GAPGCFT00155