NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15

per side.

4. Body width does not include interlead flash. Interlead flash shall not exceed 0.50 per side.

5. Strap features may not be present.

6. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PowerPAD is a trademark of Texas Instruments

PACKAGE OUTLINE

4225982/B 07/2021

www.ti.com

HTQFP - 1.2 mm max height

PLASTIC QUAD FLATPACK

PAP0064N

A

0.08 C

B

10.2

9.8

10.2

9.8

12.2

11.8

PIN 1 ID

4X 7.5

60X 0.5

64X 0.27

0.17

0.08

C A

B

SEATING PLANE

C

0.09- 0.20

TYP

SEE DETAIL A

1.2

1

1

16

17

32

33

48

49

64

(1)

0.15

0.05

0.25

GAGE PLANE

0° MIN

0°- 7°

0.75

0.45

5.30

4.06

(0.11) TYP

NOTE 5

EXPOSED

THERMAL PAD

(0.11) TYP

NOTE 5