TS4990 datasheet(29/33 Pages) STMICROELECTRONICS

No. de pieza	TS4990

Descripción Electrónicos	1.2 W audio power amplifier with active-low standby mode

PDF	33 Pages

Scroll/Zoom	100%

Fabricante Electrónico	STMICROELECTRONICS [STMicroelectronics]

Página de inicio	http://www.st.com

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29 / 33 page

DocID9309 Rev 14

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TS4990

Package information

5.3

DFN8 package information

Note:

DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal

performance, the exposed pad must be soldered to a copper area on the PCB, acting as a

heatsink. This copper area can be electrically connected to pin7 or left floating.

Figure 72. DFN8 3x3x0.90 mm package mechanical drawing (pitch 0.5 mm)

Table 9. DFN8 3x3x0.90 mm package mechanical data (pitch 0.5 mm)

Ref.

Dimensions

Millimeters

Mils

Min.

Typ.

Max.

Min.

Typ.

Max.

0.80

0.90

1.00

31.5

35.4

39.4

0.02

0.05

0.8

2.0

0.55

0.65

0.80

217

25.6

31.5

0.20

7.9

0.18

0.25

0.30

7.1

9.8

11.8

2.85

3.00

3.15

112.2

118.1

124

2.20

2.70

86.6

106.3

2.85

3.00

3.15

112.2

118.1

124

1.40

1.75

55.1

68.9

0.50

19.7

0.30

0.40

0.50

11.8

15.7

19.7

ddd

0.08

3.1

PLANE

SEATING

BOTTOM VIEW

0.15x45°

7426334_F

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