NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

PACKAGE OUTLINE

4219044/D 02/2022

www.ti.com

VQFN - 1 mm max height

PLASTIC QUADFLAT PACK- NO LEAD

RGZ0048A

A

0.08 C

0.1

C A B

0.05

C

B

SYMM

SYMM

PIN 1 INDEX AREA

7.1

6.9

7.1

6.9

1 MAX

0.05

0.00

SEATING PLANE

C

5.15±0.1

2X 5.5

2X

5.5

44X 0.5

48X 0.5

0.3

48X 0.30

0.18

PIN1 ID

(OPTIONAL)

(0.2) TYP

1

12

13

24

25

36

37

48

(0.1) TYP

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

SEE SIDE WALL

DETAIL

CHAMFERED LEAD

CORNER LEAD OPTION

(0.45) TYP

SEE LEAD OPTION