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LSF0108 Datasheet(PDF) 197 Page - Nexperia B.V. All rights reserved

No. de pieza LSF0108
Descripción Electrónicos  Discrete and MOSFET components, analog & logic ICs
PDF  234 Pages
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Fabricante Electrónico  NEXPERIA [Nexperia B.V. All rights reserved]
Página de inicio  https://www.nexperia.com/
Logo NEXPERIA - Nexperia B.V. All rights reserved

LSF0108 Datasheet(HTML) 197 Page - Nexperia B.V. All rights reserved

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197
2-pin SMD packages
Minimized outline drawings and reflow soldering footprint
3-pin SMD packages
Dimensions in mm
DFN0603-3 (SOT8013)
DFN0603-3 (SOT8013)
SOT8013
Footprint information for reflow soldering of ultra small and leadless encapsulated package; 3 terminals
sot8013_fr
Issue date 19-10-29
occupied area
solder land
(Cu extends under
solder resist)
solder resist
stencil opening
Dimensions in mm
0.85
0.33 0.48
0.68
0.145
0.12
0.12
0.12
0.15
0.15
0.145
0.135
0.135
0.1
0.95
recommended stencil thickness: 0.08 mm
R 0.03
SOT8013
Footprint information for reflow soldering of ultra small and leadless encapsulated package; 3 terminals
sot8013_fr
Issue date 19-10-29
occupied area
solder land
(Cu extends under
solder resist)
solder resist
stencil opening
Dimensions in mm
0.85
0.33 0.48
0.68
0.145
0.12
0.12
0.12
0.15
0.15
0.145
0.135
0.135
0.1
0.95
recommended stencil thickness: 0.08 mm
R 0.03
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT8013
- - -
sot8013_po
19-08-06
19-08-29
Unit(1)
mm
max
nom
min
0.275 0.03
0.350 0.650
0.12
0.03 0.05
A
Dimensions (mm are the original dimensions)
Note
1. Device is electrically symmetrical
DFN0603-3; plastic, ultra small and leadless full encapsulated package;
3 terminals; 0.225 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body
SOT8013
A1
A1
A
b
0.27
D
E
e
L
w
0.04
y
y1
0.225
0.225
0.305 0.605
0.08
0.23
0
scale
0.5 mm
C
B
E
D
seating plane
b
(3x)
L
(3x)
e
C
y1
A
C
y
A
C
B
w
e
References
Outline
version
European
projection
Issue date
IEC
JEDEC
JEITA
SOT8013
- - -
sot8013_po
19-08-06
19-08-29
Unit(1)
mm
max
nom
min
0.275 0.03
0.350 0.650
0.12
0.03 0.05
A
Dimensions (mm are the original dimensions)
Note
1. Device is electrically symmetrical
DFN0603-3; plastic, ultra small and leadless full encapsulated package;
3 terminals; 0.225 mm pitch; 0.63 mm x 0.33 mm x 0.25 mm body
SOT8013
A1
A1
A
b
0.27
D
E
e
L
w
0.04
y
y1
0.225
0.225
0.305 0.605
0.08
0.23
0
scale
0.5 mm
C
B
E
D
seating plane
b
(3x)
L
(3x)
e
C
y1
A
C
y
A
C
B
w
e
DFN1006B-3 (SOT883B)
DFN1006B-3 (SOT883B)
1.3
0.3
0.6
0.7
0.4
0.9
0.3
(2x)
0.4
(2x)
0.25
(2x)
R0.05 (8x)
0.7
sot883b_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
1.3
0.3
0.6
0.7
0.4
0.9
0.3
(2x)
0.4
(2x)
0.25
(2x)
R0.05 (8x)
0.7
sot883b_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Unit
mm
max
nom
min
0.40
0.37
0.34
0.04
0.55
0.50
0.47
0.65
0.60
0.55
1.05
1.00
0.95
0.65
0.30
0.25
0.22
A(1)
Dimensions
A1
b
0.20
0.15
0.12
b1
D
E
e
0.35
e1
L
0.30
0.25
0.22
L1
scale
L (2x)
E
2
3
1
b (2x)
b1
A1
A
D
L1
0
0.5
1 mm
e1
e
Unit
mm
max
nom
min
0.40
0.37
0.34
0.04
0.55
0.50
0.47
0.65
0.60
0.55
1.05
1.00
0.95
0.65
0.30
0.25
0.22
A(1)
Dimensions
A1
b
0.20
0.15
0.12
b1
D
E
e
0.35
e1
L
0.30
0.25
0.22
L1
scale
L (2x)
E
2
3
1
b (2x)
b1
A1
A
D
L1
0
0.5
1 mm
e1
e
CFP5 (SOD128)
1.1
0.9
0.22
0.10
0.6
0.3
5.0
4.4
4.0
3.6
1.9
1.6
2.7
2.3
1
2
CFP5 (SOD128)
solder lands
solder resist
occupied area
solder paste
2.5
3.4
2.1
(2´)
1.9
(2´)
4.4
4.2
6.2
1.2
(2´)
1.4
(2´)
sod128_fr
Dimensions in mm
Images are for reference only, for detailed drawings please visit nexperia.com/packages
DFN1006-3 (SOT883)
DFN1006-3 (SOT883)
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
1.30
0.30
R = 0.05 (12´)
R = 0.05 (12´)
0.60 0.70 0.80
0.90
0.30
(2´)
0.35
(2´)
0.20
0.40
(2´)
0.50
(2´)
0.25
(2´)
0.30
0.40
0.50
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
1.30
0.30
R = 0.05 (12´)
R = 0.05 (12´)
0.60 0.70 0.80
0.90
0.30
(2´)
0.35
(2´)
0.20
0.40
(2´)
0.50
(2´)
0.25
(2´)
0.30
0.40
0.50



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