LP3985

SNVS087AE – OCTOBER 2000 – REVISED MAY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

IN, EN

–0.3

6.5

V

OUT

−0.3

(VIN + 0.3) < 6.5

Junction temperature

150

Lead temperature

235

°C

Pad temperature(4)

235

SOT-23(5)

364

Maximum power dissipation

mW

DSBGA(5)

314

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Additional information on lead temperature and pad temperature can be found in Texas Instruments Application Note AN-1187 Leadless

Leadframe Package (LLP) (SNOA401).

(5)

The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula: PD = (TJ -

TA)/RθJA,where TJ is the junction temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance.

The 364-mW rating for SOT23-5 appearing under Absolute Maximum Ratings results from substituting the Absolute Maximum junction

temperature, 150°C for TJ, 70°C for TA, and 220°C/W for RθJA. More power can be dissipated safely at ambient temperatures below

70°C . Less power can be dissipated safely at ambient temperatures above 70°C. The Absolute Maximum power dissipation can be

increased by 4.5 mW for each degree below 70°C, and it must be derated by 4.5 mW for each degree above 70°C.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Supply input voltage

2.5(1)

6

V

VEN

ON/OFF input voltage

0

VIN

V

IOUT

Output current

150

mA

TJ

Operating junction temperature

−40

125

°C

(1)

Recommended minimum VIN is the greater of 2.5-V or VOUT(MAX) + rated dropout voltage (max) for operating load current.

6.4 Thermal Information

LP3985

THERMAL METRIC(1)

SOT-23 (DBV)

DSBGA (YZR)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

220

255

RθJC(top)

Junction-to-case (top) thermal resistance

79.8

0.8

RθJB

Junction-to-board thermal resistance

31.6

107.9

°C/W

ψJT

Junction-to-top characterization parameter

3.1

0.5

ψJB

Junction-to-board characterization parameter

31.1

107.9

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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