4

LM5008A

SNVS583H – MARCH 2009 – REVISED OCTOBER 2018

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Copyright © 2009–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN to GND

–0.3

100

V

BST to GND

–0.3

114

V

SW to GND (steady-state)

–1

V

BST to VCC

100

V

BST to SW

14

V

VCC to GND

14

V

All other inputs to GND

–0.3

7

V

Storage temperature, Tstg

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

6

95

V

Operating junction temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM5008A

UNIT

DGK (VSSOP)

NGU (WSON)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

139.7

42

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.2

27.6

°C/W

RθJB

Junction-to-board thermal resistance

70.5

18.5

°C/W

ψJT

Junction-to-top characterization parameter

3.4

0.3

°C/W

ψJB

Junction-to-board characterization parameter

69.5

18.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

4.3

°C/W