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MIC5166 Datasheet(PDF) 18 Page - Microchip Technology |
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MIC5166 Datasheet(HTML) 18 Page - Microchip Technology |
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18 / 36 page ![]() MIC5166 DS20006085B-page 18 2018 - 2019 Microchip Technology Inc. 5.5 Thermal Measurements It is always wise to measure the IC’s case temperature to make sure that it is within its operating limits. Although this might seem like a very elementary task, it is very easy to get erroneous results. The most common mistake is to use the standard thermocouple that comes with the thermal voltage meter. This thermocouple wire gauge is large, typically 22 gauge, and behaves like a heat sink, resulting in a lower case measurement. There are two suggested methods for measuring the IC case temperature: a thermocouple or an infrared thermometer. If a thermocouple is used, it must be constructed of 36 gauge wire or higher to minimize the wire heat sinking effect. In addition, the thermocouple tip must be covered in either thermal grease or thermal glue to make sure that the thermocouple junction makes good contact to the case of the IC. This thermocouple from Omega (5SC-TT-K-36-36) is adequate for most applications. To avoid this messy thermocouple grease or glue, an infrared thermometer is recommended. Most infrared thermometers’ spot size is too large for an accurate reading on small form factor ICs. However, an IR thermometer from Optris has a 1 mm spot size, which makes it ideal for the 3 mm x 3 mm DFN package. 5.6 Sequencing The following diagrams illustrate methods for connecting MIC5166s to achieve sequencing requirements: FIGURE 5-1: Turn-On Sequence with Soft-Start (RC = 3.3 nF). PVIN SW FB PG 22μF x4 VDDQ 1.8V/7A 1.0μH PGND 47μF x2 MIC22705 PG1 COMP VIN 5.0V EN/DLY EN1 4 SGND 20 39pF SVIN RC 3.3nF EP DELAY R1 1.10 R2 69 VTT 1.0μF 22μF AGND EN EP VDDQ 4.7μF MIC5166 BIAS VDDQ SNS 10μF VIN EN2 VTT 0.9V/±3A PG PG2 PGND VREF 1.0μF VREF 10mA EN/EN2 V DDQ V TT V IN = 5V V DDQ = 1.8V V TT = 0.9V I OUT1 = 1A I OUT2 = 1A R C = 3.3nF Time (4ms/div) |
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