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F0452BLEGK Datasheet(PDF) 13 Page - Renesas Technology Corp |
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F0452BLEGK Datasheet(HTML) 13 Page - Renesas Technology Corp |
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13 / 27 page ![]() F0452B Datasheet © 2019 Renesas Electronics Corporation 13 July 13, 2021 Thermal Characteristics Table 7. Thermal Characteristics Parameter Symbol Value Units Junction-to-Ambient Thermal Resistance θJA 43 °C/W Junction-to-Case Thermal Resistance (Case is defined as the exposed paddle) θJC_BOT 11.7 °C/W Moisture Sensitivity Rating (Per J-STD-020) MSL3 Typical Operating Conditions Unless otherwise noted: VDD = +3.3V TEPAD = 25°C ZL = ZS = 50Ω single-ended with matching networks STBY1 = STBY2 = LOW or open SW_CTRL = LOW or open Gain Setting = High Gain Mode PIN ≤ -30dBm All temperatures are referenced to the exposed paddle Evaluation kit traces and connector losses are de-embedded |
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