.000 PKG

0

(

)

2.9

(

)

2.25

(

)

2.05

(

)

1.275

(

)

0.5

(

)

0.3

(

)

0.3

5X (

)

1.15

5X ( )

2

(

)

2.6

(

) TYP

3.2

(

)

0.025

(

)

2.2

(

)

0.8

(

)

0.4

(

)

0.1

(

)

0.3

(

)

2.25

16X (0.6)

16X (0.25)

14X (0.45)

19X (0.45)

(

)

1.05

(

)

2.05

(

)

2.175

(

) TYP

2.75

20X (0.25)

(R0.05) TYP

(0.05) MIN

TYP

(

0.2) VIA

TYP

7

LAND PATTERN EXAMPLE

PKG

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING, TYP

1

6

9

10

19

20

24

25

29

30

39

40

41

8

CSD95482RWJ

SLPS688 – JUNE 2017

www.ti.com

Product Folder Links: CSD95482RWJ

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Copyright © 2017, Texas Instruments Incorporated

9.2 Recommended PCB Land Pattern

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning

and tolerancing per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This package is designed to be soldered to thermal pads on the board. For more information, see QFN/SON

PCB Attachment (SLUA271).