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ISL73847SEHDEMO2Z Datasheet(PDF) 35 Page - Renesas Technology Corp |
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ISL73847SEHDEMO2Z Datasheet(HTML) 35 Page - Renesas Technology Corp |
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35 / 40 page ![]() R34DS0017EU0104 Rev.1.04 Page 35 Jan 31, 2025 ISL73041SEH Datasheet 8.1 Metalization Mask Layout Table 3. Layout X-Y Coordinates (Centroid of Bond Pad)[1] Pad Name Pad Number[2] X Coordinate (µm) Y Coordinate (µm) Pad X Dimension (µm) Pad Y Dimension (µm) Bond Wire Diameter (0.001”) EN 1 842.5 2529.14 110 110 1.25 PWM 2 413.46 2510.55 110 110 1.25 FLT 3 177.54 1384.83 110 110 1.25 RDU 4 177.54 1124.81 110 110 1.25 RDL 5 177.54 690.56 110 110 1.25 AVCC 6 177.54 430.56 110 110 1.25 VDD 7 539.75 154.86 110 110 1.25 FB 8 918.37 154.86 110 110 1.25 PVCC 9 (a) 1220.02 154.86 110 110 1.25 PVCC 9 (b) 1475.02 154.86 110 110 1.25 PGND 10 (a) 1954.00 134.50 110 110 1.25 PGND 10 (b) 2204.00 134.50 110 110 1.25 LGL 11 (a) 2529.14 438.13 110 110 1.25 EN PWM FLT RDU RDL AVCC VDD FB SGND PVCC PVCC PGND PGND LGL LGL LGH LGH PHS PHS UGL UGL UGH UGH BOOT BOOT |
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