TDA7417 datasheet(32/34 Pages) STMICROELECTRONICS

32 / 34 page

Package information

TDA7417

32/34

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 19. TQFP32 Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

0060661 C

Seating Plane

TQFP32

0.10mm

.004

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.063

0.05

0.15

0.002

0.006

1.35

1.40

1.45

0.053

0.055

0.057

0.30

0.37

0.45

0.012

0.015

0.018

0.09

0.20

0.004

0.008

9.00

0.354

7.00

0.276

5.60

0.220

0.80

0.031

9.00

0.354

7.00

0.276

5.60

0.220

0.45

0.60

0.75

0.018

0.024

0.030

1.00

0.039

0˚(min.), 3.5

°(typ.), 7°(max.)

TQFP32 (7 x 7 x 1.40mm)

Weight: 0.20gr

TDA7417 Datasheet(PDF) 32 Page - STMicroelectronics

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