Data Sheet

ADG901/ADG902

Rev. D | Page 13 of 13

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 25. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

8

1

5

4

0.30

0.25

0.20

PIN 1 INDEX

AREA

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50

BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED-4

TOP VIEW

BOTTOM VIEW

SIDE VIEW

SEATING

PLANE

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

ADG901BRMZ

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

S1T

ADG901BRMZ-REEL7

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

S1T

ADG901BCPZ-500RL7

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

S1T

ADG902BRMZ

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

S1V

EVAL-ADG901EBZ

ADG901 Evaluation Board

EVAL-ADG902EBZ

ADG902 Evaluation Board

1 Z = RoHS Compliant Part.

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registered trademarks are the property of their respective owners.

D03336-0-11/17(D)