TLV755P datasheet(21/49 Pages) TI1

No. de pieza	TLV755P

Descripción Electrónicos	TLV755P 500mA, Low-IQ, Small-Size, Low-Dropout Regulator

PDF	49 Pages

Scroll/Zoom	100%

Fabricante Electrónico	TI1 [Texas Instruments]

Página de inicio	http://www.ti.com

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21 / 49 page

7.4 Layout

7.4.1 Layout Guidelines

• Place input and output capacitors as close as possible to the device.

• Use copper planes for device connections to optimize thermal performance.

• Place thermal vias around the device to distribute the heat.

• For packages with thermal pads, solder the thermal pad to copper to achieve best thermal resistance.

Thermal resistance increases significantly when the thermal pad is not soldered.

7.4.2 Layout Examples

OUT

GND PLANE

Represents via used for application

specific connections

OUT

Figure 7-6. Layout Example for the DQN Package

VOUT

VIN

GND PLANE

Represents via used for

application specific connections

OUT

Figure 7-7. Layout Example for the DBV Package

VIN

VOUT

GND PLANE

Represents via used for

application specific connections

OUT

Figure 7-8. Layout Example for the DRV Package

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TLV755P

SBVS320D – NOVEMBER 2017 – REVISED SEPTEMBER 2024

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TLV755P Datasheet(PDF) 21 Page - Texas Instruments