ATH06T033 datasheet(3/14 Pages) ASTEC

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Environmental & Absolute Maximum Ratings (Voltages are with respect to GND)

Characteristics

Symbols

Conditions

Min

Typ

Max

Units

Track Input Voltage

Vtrack

–0.3

—

Vin + 0.3

Operating Temperature Range

Over Vin Range

–40 (i)

—

°C

Solder Reflow Temperature

Treflow

Surface temperature of module body or pins

235 (ii)

°C

Storage Temperature

—

–40

—

125

°C

Mechanical Shock

Per Mil-STD-883D, Method 2002.3

—

TBD

—

G’s

1 msec, ½ Sine, mounted

Mechanical Vibration

Mil-STD-883D, Method 2007.2

Suffix H

—

TBD

—

G’s

20-2000 Hz

Suffix S

—

TBD

—

Weight

—

2.9

—

grams

Flammability

—

Meets UL 94V-O

Notes:

(i) For operation below 0 °C the external capacitors m ust bave stable characteristics. use either a low ESR tantalum, Os-Con®, or ceramic capacitor.

(ii) During reflow of SMD package version do not elevate peak temperature of the module, pins or internal components above the stated maximum.

6-A, 3.3-V Input Non-Isolated

Wide-Output Adjust Power Module

ATH06T033 Series —3.3-V Input

Specifications (Unless otherwise stated, Ta =25 °C, Vin =3.3 V, Vo =2.5 V, Coin =100 µF, Co1 =0 µF, Co2 =0 µF, and Io =Iomax)

ATH06T033

Characteristics

Symbols

Conditions

Min

Typ

Max

Units

Output Current

0.8 V

≤ Vo ≤ 2.5 V,

85 °C, natural convection

—

(1)

Input Voltage Range

Vin

Over Io range

2.95

—

3.65

Set-Point Voltage Tolerance

Vo tol

—

±2 (2)

%Vo

Temperature Variation

∆Regtemp

–40 °C <Ta < +85 °C

—

±0.5

—

%Vo

Line Regulation

∆Regline

Over Vin range

—

±10

—

Load Regulation

∆Regload

Over Io range

—

±12

—

Total Output Variation

∆Regtot

Includes set-point, line, load,

——±3 (2)

%Vo

–40 °C

≤ Ta ≤ +85 °C

Efficiency

Io =4 A

RSET = 2.21 kΩ Vo = 2.5 V

—

RSET = 4.12 kΩ Vo = 2.0 V

—

RSET = 5.49 kΩ Vo = 1.8 V

—

RSET = 8.87 kΩ Vo = 1.5 V

—

RSET = 17.4 kΩ Vo = 1.2 V

—

RSET = 36.5 kΩ Vo = 1.0 V

—

Vo Ripple (pk-pk)

20 MHz bandwidth, Co2 =10 µF ceramic

—

20 (3)

—

mVpp

Over-Current Threshold

Io trip

Reset, followed by auto-recovery

—

Transient Response

1 A/µs load step, 50 to 100 % Iomax,

Co1 =100 µF

ttr

Recovery Time

—

µSec

∆Vtr

Vo over/undershoot

—

100

—

Track Input Current (pin 2)

IIL track

Pin to GND

—

–130 (4)

µA

Track Slew Rate Capability

dVtrack/dt

Vtrack – Vo ≤ 50 mV and Vtrack < Vo(nom)

—

V/ms

Under-Voltage Lockout

UVLO

Vin increasing

—

4.3

4.45

Vin decreasing

3.4

3.7

—

Inhibit Control (pin4)

Referenced to GND

Input High Voltage

VIH

Vin –0.5

—

Open (4)

Input Low Voltage

VIL

–0.2

—

0.6

Input Low Current

IIL inhibit

Pin to GND

—

–130

—

µA

Input Standby Current

Iin inh

Inhibit (pin 4) to GND, Track (pin 2) open

—

Switching Frequency

ƒs

Over Vin and Io ranges

550

600

650

kHz

External Input Capacitance

Cin

100 (5)

——µF

External Output Capacitance

Cout

100 (6)

TBD

µF

Reliability

MTBF

Per Bellcore TR-332

TBD

—

106 Hrs

50 % stress, Ta =40 °C, ground benign

Notes: (1) No derating is required when the module is soldered directly to a 4-layer PCB with 1 oz. copper.

(2) The set-point voltage tolerance is affected by the tolerance and stability ofRSET. The stated limit is unconditionally met if RSET has a tolerance of 1 %

with 100 ppm/°C or better temperature stability.

(3) The pk-pk output ripple voltage is measured with an external 10 µF ceramic capacitor. See the standard application schematic.

(4) This control pin has an internal pull-up to the input voltage Vin. If it is left open-circuit the module will operate when input power is applied. A small

low-leakage (<100 nA) MOSFET is recommended for control. For further information, consult the related application note.

(5) A 100 µF input capacitor is required for proper operation. The capacitor must be rated for a minimum of 300 mA rms of ripple current.

(6) An external output capacitor is not required for basic operation. Adding 100 µF of distributed capacitance at the load will improve the transient response.

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