TMP86FS28DFG datasheet(267/272 Pages) TOSHIBA

267 / 272 page

Page 255

TMP86FS28DFG

20.7 Recommended Oscillating Conditions

Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these

factors are greatly affected by board patterns, please be sure to evaluate operation on the board on which the

device will actually be mounted.

Note 2: For the resonators to be used with Toshiba microcontrollers, we recommend ceramic resonators manufactured by

Murata Manufacturing Co., Ltd.

For details, please visit the website of Murata at the following URL:

http://www.murata.com

20.8 Handling Precaution

- The solderability test conditions for lead-free products (indicated by the suffix G in product name) are shown

below.

1. When using the Sn-37Pb solder bath

Solder bath temperature = 230

°C

Dipping time = 5 seconds

Number of times = once

R-type flux used

2. When using the Sn-3.0Ag-0.5Cu solder bath

Solder bath temperature = 245

°C

Dipping time = 5 seconds

Number of times = once

R-type flux used

Note: The pass criteron of the above test is as follows:

Solderability rate until forming

≥ 95 %

- When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we

recommend electrically shielding the package in order to maintain normal operating condition.

(2) Low-frequency Oscillation

(1) High-frequency Oscillation

XIN

XOUT

XTIN

XTOUT

TMP86FS28DFG Datasheet(PDF) 267 Page - Toshiba Semiconductor