EC900-QCS datasheet(1/2 Pages) DFI

No. de pieza	EC900-QCS

Descripción Electrónicos	Qualcomm® QCS6490 Ultra Small Size Embedded System

PDF	2 Pages

Scroll/Zoom	100%

Fabricante Electrónico	DFI [DFI Inc]

Página de inicio	https://www.dfi.com/

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1 / 2 page

Qualcomm® QCS6490

Ultra Small Size Embedded System

EC900-QCS

KEY FEATURES

Qualcomm

Qualcomm QCS6490 high-level platform

Multiple Expansions

1 M.2 E key 2230, 1 M.2 B key 3052

High Speed Memory Down

LPDDR5x on board memory up to 8G

AMR

Target on AMR, box PC application

Rich I/O

2 USB 3.1, 1 GbE LAN, 1 HDMI, 1 Audio Jack,

1 COM, 8 bit DIO/1 CAN FD

PANEL

Front View

Rear View

Left View

Right View

Número de pieza similar - EC900-QCS

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
DFI Inc	EC900-8MM	1Mb / 5P	NXP i.MX8M Mini Processor Ultra Small Size Embedded System
	EC900-FS6	721Kb / 4P	Fanless Embedded System
	EC900-FS6DL	721Kb / 4P	Fanless Embedded System

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
DB Lectro Inc	NCT	116Kb / 2P	Ultra small size, light weight.
Advantech Co., Ltd.	EBPC-3500L-61SE	343Kb / 2P	Ultra-compact Intel짰 Atom??N270 Embedded System
Texas Instruments	ADS7040	1Mb / 42P	Ultra-Low Power, Ultra-Small Size
Murata Manufacturing Co...	NFM18P	77Kb / 4P	Ultra small size in 1.6x0.8mm
Compex Systems Pte. Lte...	AP.CP03	817Kb / 8P	Qualcomm?셲 IPQ6000 WiFi 6 (802.11ax) Embedded Board
DFI Inc	ST101-CP	1Mb / 2P	Embedded System
Murata Manufacturing Co...	NFL18SP207X1A3	292Kb / 3P	Ultra-small size in 1.6x0.8x0.6 mm Last updated07/26/2022
Murata Manufacturing Co...	NFL18SP307X1A3	291Kb / 3P	Ultra-small size in 1.6x0.8x0.6 mm Last updated07/26/2022
BCM Advanced Research.	EPS-CFS	406Kb / 1P	Intel® 8th/9th Coffee Lake Rugged Fanless Embedded System 2020/04/27
AAEON Technology	BOXER-8224AI	764Kb / 2P	AI@Edge Embedded System with NVIDIA® Jetson Nano™ 2023/03/24