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54HC240 Datasheet(PDF) 1 Page - Silicon Supplies

No. de pieza 54HC240
Descripción Electrónicos  High Speed CMOS Logic
PDF  6 Pages
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Fabricante Electrónico  SS [Silicon Supplies]
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54HC240 Datasheet(HTML) 1 Page - Silicon Supplies

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High Speed CMOS Logic – 54HC240
Octal 3-State Inverting Buffer / Line Driver / Line Receiver in bare die form
Rev 1.1
30/11/21
Features:
Output Drive Capability: 15 LSTTL Loads
Low Input Current: 1µA
Outputs directly interface CMOS, NMOS and TTL
Operating Voltage Range: 2V to 6V
CMOS High Noise Immunity
Function compatible with 54LS240
Lower power alternative to Bipolar or BiCMOS logic
Full military temperature range.
Ordering Information
Description
Die Dimensions in µm (mils)
The 54HC240 is produced on a 2.5µm 5V CMOS process
combining high speed LSTTL performance with CMOS low
power. The device can be used as two 4-bit buffers or one
8-bit buffer & features inverting inputs with two output
enables, each controlling four of the 3-state outputs. The
device improves performance & density in clock drivers, 3-
state memory address drivers & bus orientated transmitters
and receivers. Device inputs are compatible with standard
CMOS outputs; with pull-up resistors, they are compatible
with LSTTL outputs. All inputs are equipped with protection
circuits against static discharge & transient excess voltage.
The following part suffixes apply:
1950 (77)
No suffix - MIL-STD-883 /2010B Visual Inspection
“H” - MIL-STD-883 /2010B Visual Inspection
+ MIL-PRF-38534 Class H LAT
“K” - MIL-STD-883 /2010A Visual Inspection (Space)
+ MIL-PRF-38534 Class K LAT
LAT = Lot Acceptance Test.
For further information on LAT process flows see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
Die Size (Unsawn)
1950 x 2050
77 x 81
µm
mils
Minimum Bond Pad Size
106 x 106
4.17 x 4.17
µm
mils
Die Thickness
350 (±20)
13.78 (±0.79)
µm
mils
Top Metal Composition
Al 1%Si 1.1µm
Back Metal Composition
N/A – Bare Si
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (100 per tray capacity)
Sawn Wafer on Tape – On request
Unsawn Wafer – On request
Die Thickness <> 350µm(14 Mils) – On request
Assembled into Ceramic Package – On request
Page 1 of 6
www.siliconsupplies.com


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