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MNSC140CORE Datasheet(PDF) 82 Page - Freescale Semiconductor, Inc |
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MNSC140CORE Datasheet(HTML) 82 Page - Freescale Semiconductor, Inc |
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82 / 88 page  MSC8122 Technical Data, Rev. 13 3-20 Freescale Semiconductor Packaging 3.2 MSC8122 Package Mechanical Drawing Figure 3-3. MSC8122 Mechanical Information, 431-pin FC-PBGA Package Notes: 1. All dimensions in millimeters. 2. Dimensioning and tolerancing per ASME Y14.5M–1994. 3. Features are symmetrical about the package center lines unless dimensioned otherwise. 4. Maximum solder ball diameter measured parallel to Datum A. 5. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 6. Parallelism measurement shall exclude any effect of mark on top surface of package. 7. Capacitors may not be present on all devices. 8. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top. 9. FC CBGA (Ceramic) package code: 5238. FC PBGA (Plastic) package code: 5263. 10.Pin 1 indicator can be in the form of number 1 marking or an “L” shape marking. |
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