Discontinued

Parts

CAT24WC03/05

10

Doc. No. 1005, Rev. F

© 2005 by Catalyst Semiconductor, Inc.

Characteristics subject to change without notice

8 LEAD MSOP (R, Z, GZ)

0.0150

0.0110

0.38

0.28

0.1970

0.1890

5.00

4.80

S

0.0256 [0.65] BSC

0.1220

0.1142

3.10

2.90

0.0433 [1.10] MAX.

0.039 [0.10] MAX.

S

0.0059

0.0020

0.15

0.05

S

0.0374

0.0295

0.95

0.75

0.0276

0.0157

0.70

0.40

0.1220

0.1142

3.10

2.90

0˚ - 6˚

0.0091

0.0051

0.23

0.13

0.0118 [0.30] REF.

BASE METAL

0.0050 [0.127]

0.0150

0.0110

0.38

0.28

WITH

PLATING

SECTION A - A

WITH PLATING

Notes:

(1) All dimensions are in mm Angles in degrees.

2

Does not include Mold Flash, Protrusion or Gate Burrs. Mold Flash, Protrusions or Gate Burrs shall not exceed 0.15 mm. per side.

3

Does not include Interlead Flash orProtrusion. Interlead Flash or Protrusion shall not exceed 0.25 mm per side.

4

Does not include Dambar Protrusion, allowable Dambar Protrusion shall be 0.08 mm.

(5) This part is compliant with JEDEC Specification MO-187 Variations AA.

(6) Lead span/stand off height/coplanarity are considered as special characteristics. (S)

(7) Controlling dimensions in inches. [mm]