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CSL1101WBAW1CS2 Datasheet(PDF) 6 Page - Rohm |
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CSL1101WBAW1CS2 Datasheet(HTML) 6 Page - Rohm |
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6 / 24 page ![]() [CSL1101WBAW1] [Data Sheet] 【 STRUCTURE・ MATERIAL】 No. APPELLATION MATERIAL ① Printed Wiring Board Glass epoxy ② Die Bond Resin paste ③ LED Chip InGaN ④ Bonding Wire Gold ⑤ Reflector Thermosetting Resin ⑥ Resin Phosphor / Silicone resin ⑦ Electrode Base plating:Cu,Ni Top plating:Au 6/22 2024.6 - Rev.003 www.rohm.com ©2024 ROHM Co., Ltd. All rights reserved |
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